DOWSIL™

Silicone adhesives, sealants, conformal coatings, encapsulants, thermal materials, foams, primers, and related electronics and industrial materials.

SYLGARD™

Silicone dielectric gels and elastomer systems used for potting, encapsulation, casting, cushioning, and low-stress electronics protection.

DOWFROST™

Inhibited heat-transfer fluids used in industrial cooling, closed-loop systems, and appropriate data-center and liquid-cooling applications.

XIAMETER™

Silicone fluids, elastomers, intermediates, and related materials used in industrial processing and formulation applications.

Adhesives & Sealants

Dow bonding and sealing materials include one-part RTV silicone adhesive sealants, higher-performance silicone adhesive technologies, and primers or adhesion promoters used to prepare challenging substrates. Selection depends on cure method, handling strength, substrate combination, bond-line or seal geometry, environmental exposure, production method, and whether primer-assisted adhesion is required for the specified assembly.

Encapsulants & Gels

Dow dielectric gels and silicone elastomer systems protect electronic assemblies through low-stress cushioning, dielectric protection, potting, casting, and environmental isolation. Soft gels are suited to sensitive components where mechanical stress must be limited, while cured elastomer systems provide more defined support and encapsulation. Selection should account for cured modulus, working time, cure schedule, fill geometry, component sensitivity, dielectric requirements, and rework strategy.

Thermal Interface Materials

Dow thermal-management materials span curable gap fillers and thermal gels, thermally conductive adhesives, non-curing compounds and greases, and thermally conductive encapsulants. Selection should start with the required thermal path and gap or bond-line thickness, then account for compressibility, dispensing method, cure requirements, electrical insulation, mechanical attachment, reworkability, component stress, and service conditions.

Conformal Coatings

DOWSIL conformal coatings protect printed circuit assemblies from moisture, contamination, corrosion, and environmental exposure using multiple processing approaches. Depending on the product, options include moisture cure with room-temperature or heat-accelerated processing, UV cure with secondary moisture cure, lower-VOC solvent-borne systems, and no-added-solvent technologies. Selection should consider application method, cure window, coating coverage, production-line compatibility, rework needs, and required assembly protection.

Liquid Cooling & Heat Transfer Fluids

Dow supports liquid-cooling architectures from direct-to-chip technology cooling loops to facility water-loop heat transfer and immersion cooling. DOWFROST LC-25 is positioned for direct-to-chip data-center cooling, while other DOWFROST fluids serve closed-loop infrastructure and DOWSIL dielectric fluids support immersion-cooling designs. Fluid selection is system-specific and should account for loop materials, heat load, corrosion control, operating temperature, electrical requirements, maintenance practices, and equipment-manufacturer guidance.

Silicone Foams & Gasketing

DOWSIL two-part silicone foams can be dispensed and cured directly on parts to create integrated compression gaskets and environmental seals. These materials are relevant to automotive components, electrical housings, exterior lighting, appliances, and industrial enclosures where sealing force, gap variation, compression recovery, vibration damping, and automated gasket placement are important selection factors.

Direct-to-Chip Liquid Cooling for Data Centers

DOWFROST™ LC-25 supports direct-to-chip liquid-cooling loops used to remove heat from high-density computing equipment. Fluid selection should be evaluated as part of the complete cooling architecture, including operating temperature, loop materials, corrosion-control requirements, water quality, maintenance practices, and equipment-manufacturer guidance.

Talk to our Experts

Whether you are comparing Dow materials for bonding and sealing, electronics protection, conformal coating, thermal management, gasketing, or liquid cooling, Krayden can help evaluate product fit, application requirements, process constraints, and candidate materials for your assembly or cooling system.

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