LORD

Structural adhesive systems spanning epoxy, structural acrylic, urethane, and specialty chemistries for engineered assembly. Product selection depends on substrates, bond geometry, cure and handling requirements, and the mechanical demands of the finished assembly.

COOLTHERM

Thermal-management and electronic materials including thermally conductive adhesives, gap fillers, gels, potting and encapsulation systems, die-attach materials, and semiconductor-package protection products.

Chemlok

Elastomer-bonding materials for rubber-to-metal and rubber-to-substrate applications, including systems used during molding and specialized bonding processes.

Structural Adhesives

Parker LORD structural adhesives include epoxy, structural acrylic, urethane, and specialty systems for joining metals, composites, plastics, and other engineered assemblies. Different chemistries address different combinations of cure speed, stiffness or flexibility, gap filling, impact and peel requirements, substrate preparation, and production method.

Thermal Management Materials

COOLTHERM materials support thermal interfaces and component protection in EV batteries, power electronics, motors, semiconductor assemblies, and other heat-generating systems. The portfolio includes thermally conductive adhesives, dispensable gap fillers, gels, and potting or encapsulation systems.

Rubber-to-Substrate Bonding

Chemlok bonding systems are used to bond rubber and other elastomers to metal and selected rigid substrates during molding, curing, and specialized post-vulcanization processes. Product selection depends on elastomer type, substrate, molding conditions, cure temperature, surface preparation, and required environmental resistance.

Electronic Assembly & Semiconductor Packaging

Parker LORD electronic materials support semiconductor die attachment, package underfill, encapsulation, and related electronic assembly requirements. Selection depends on package architecture, thermal and electrical requirements, cure conditions, flow behavior, coefficient-of-thermal-expansion considerations, reliability targets, and manufacturing process.

Surface Preparation Materials

Parker LORD surface-preparation materials include primers, accelerators, and adhesion promoters used with selected adhesive and elastomer-bonding processes. These products should be matched to the exact adhesive system, substrate condition, cleaning method, and production sequence.

Primers

Primers condition properly prepared substrates before selected adhesive or elastomer-bonding processes. The correct primer depends on substrate, adhesive chemistry, cleaning process, coating method, and drying requirements.

Accelerators

Accelerators are paired with specified LORD adhesive systems to initiate or influence cure behavior. Working time, production cycle, application sequence, and adhesive compatibility should be confirmed for the selected system.

Adhesion Promoters

Adhesion promoters and surface treatments improve receptivity of selected plastics, rubbers, and other difficult substrates when used with compatible bonding systems and the specified surface-preparation process.

EV Battery Packs

Parker LORD materials address several important interfaces within EV battery assemblies. LORD structural adhesives support bonded pack and module construction, while COOLTHERM materials provide options for thermal transfer, filling irregular interfaces, and potting or encapsulating selected components.

Talk to our Experts

Krayden can help compare Parker LORD materials for structural bonding, thermal management, electronic assembly, elastomer bonding, surface preparation, and related manufacturing requirements. Our team can support product selection, substrate and application review, processing considerations, and comparison of candidate materials for your production needs.

Parker LORD Quick Reference