Solstice

Solstice Advanced Materials

Solstice Advanced Materials Thermal Interface Materials & Heat Spreaders

Solstice Advanced Materials develops thermal-management materials for semiconductor packaging and electronic assemblies, including phase change materials, thermal gap pads, hybrid thermal materials, thermal greases, thermal insulators, putty pads, and heat spreaders. The business became an independent company in 2025 following the spin-off of Honeywell Advanced Materials, so some established product families and legacy product codes may still reflect their Honeywell origin.

Krayden supplies a selection of Solstice thermal-management materials and can support product comparison, interface and gap requirements, material-format selection, assembly considerations, and processing needs. Product suitability depends on the specific device architecture, thermal target, mechanical constraints, electrical-isolation requirements, and service environment.

Markets Served by Solstice Advanced Materials

Semiconductors Electronics AI & Data Centers Automotive Telecommunications Aerospace & Defense Industrial Manufacturing
 
Thermal interface material applied between an electronic component and cooling surface
Thermal Management Technologies

Thermal Interface Materials

Solstice thermal interface materials are used between heat-generating components and heat-spreading or heat-removal surfaces to reduce air gaps and improve thermal contact. The portfolio spans thin-interface phase change materials, compressible gap pads, dispensable one- and two-part hybrid thermal materials, conformable putty pads, thermal greases, and electrically insulating thermal pads. Selection depends on interface geometry, bond-line or gap requirements, compressibility, electrical isolation, application method, rework needs, and the thermal and mechanical demands of the assembly.

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Interface Technology

Phase Change Materials

Solstice phase change materials soften at operating temperature to wet mating surfaces and form a thin thermal interface. They are used in demanding semiconductor and electronics assemblies where processors, GPUs, AI accelerators, power devices, or other high-heat components must transfer heat into a heat spreader, heat sink, heat pipe, or related cooling structure.

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Gap-Filling Format

Thermal Gap Pads

Thermal gap pads provide a compressible interface for assemblies with larger or less uniform spacing between heat sources and cooling surfaces. Material choice should account for gap size, compression force, conformity, electrical properties, surface contact, and the stress that can be tolerated by the component and board.

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Dispensable Thermal Gel

Two-Part Hybrid Thermal Gels

HLT-series two-part hybrid materials are dispensable thermally conductive gels used where a cured-in-place interface can conform to component-to-cooling-surface gaps. Selection should consider gap geometry, dispensing behavior, cure requirements, compression force, rework needs, and the thermal and reliability requirements of the assembly.

Additional Thermal Interface Technologies

Additional Solstice TIM families provide options for conformable putty-pad formats, pre-cured dispensable materials, grease interfaces, and electrically insulating thermal paths.

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Conformable Pad Format

Thermal Putty Pads

Solstice TGPxxxxPT putty pads use a highly conformable, putty-like pad format for interfaces with larger dimensional variation. They are distinct from conventional gap pads and are selected around gap range, compression, handling, component stress, and assembly geometry.

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Pre-Cured Dispensable Material

One-Part Hybrid Thermal Materials

HT-series one-part hybrid materials are pre-cured, dispensable thermal gap-filling materials that avoid two-component mixing. They can be considered where conformability, controlled dispensing, reworkability, gap geometry, and assembly stress are important selection factors.

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Non-Curing Interface Material

Thermal Greases

Solstice thermal greases are non-curing interface materials used to wet surface irregularities at relatively thin interfaces. Selection should reflect the required application method, bond-line target, thermal requirement, component geometry, service conditions, and manufacturing process.

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Electrically Insulating Interface

Thermal Insulators

TIP-series thermal insulators combine a thermally conductive interface with electrical isolation for assemblies that require heat transfer across an insulating layer. Product selection should consider thickness, electrical requirements, mounting pressure, mechanical durability, and the thermal path of the device.

 
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Semiconductor Thermal Hardware

Heat Spreaders

Solstice heat spreaders are metal lid and heat-spreading components used in semiconductor thermal-management assemblies to distribute heat from the package toward a larger cooling interface. The appropriate manufacturing route depends on the required geometry, dimensions, material and plating requirements, package architecture, tooling approach, and expected production method.

HW-HSPS progressive-stamped heat spreader
Manufacturing Process

Progressive-Stamped Heat Spreaders

Progressive stamping forms the heat-spreader lid through a sequence of tooling operations. This route can be evaluated for compatible package geometries and form factors where the specified dimensions, lid design, material, and finish can be achieved through the progressive tooling sequence.

HW-HSTD transfer-die-stamped heat spreader
Manufacturing Process

Transfer-Die-Stamped Heat Spreaders

Transfer die stamping moves the workpiece between forming operations and can support heat-spreader designs that require a different forming sequence from progressive tooling. Selection should be based on the specified part geometry, dimensional requirements, material and plating needs, tooling strategy, and manufacturing plan.

 
Application Spotlight

AI & Data Center Thermal Management

Higher processor, GPU, accelerator, memory, and power-electronics density increases the thermal load that must be managed within AI servers and high-performance-computing systems. Solstice thermal interface materials can be evaluated across package, heat-spreader, heat-sink, cold-plate, and chassis interfaces, with material selection driven by interface geometry, thermal requirements, compressibility, electrical isolation, assembly process, and service conditions.

Interfaces
Phase change materials
Gap Filling
Thermal gap pads
Dispensable
Thermal gels & greases
Heat Spreading
Heat spreader materials
Explore the Application Page
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Talk to our Experts

Krayden can help compare Solstice thermal interface materials and heat-spreader options for semiconductor, electronics, automotive, telecommunications, and high-performance-computing applications. Our team can support material selection, interface and gap requirements, electrical-isolation needs, application methods, processing considerations, and comparison of candidate thermal-management materials for your assembly.

Contact our team Call +1 (800) 448-0406

Solstice Advanced Materials Quick Reference

Supplier
Solstice Advanced Materials
Core Technology
Semiconductor & Electronics Thermal Management
Top Categories
Thermal Interface Materials & Heat Spreaders
Key TIM Families
Phase Change Materials, Gap Pads, Hybrid Thermal Materials, Greases & Insulators

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